<産業資料/調査レポートの題名> 2022年6月17日

世界の半導体製造装置市場:フロントエンド装置別(リソグラフィー、ウェーハ表面調整、堆積)、バックエンド装置別、製造施設機器別、製品種類別、寸法別、サプライチェーン参加者別、地域別


◆英文タイトル:Semiconductor Manufacturing Equipment Market by Front-end Equipment (Lithography, Wafer Surface Conditioning, Deposition), Back-end Equipment, Fab Facility Equipment, Product Type, Dimension, Supply Chain Participant, Region - Global Forecast to 2025

1 Introduction (Page No. – 20)
1.1 Study Objectives
1.2 Definition
1.2.1 Inclusions and Exclusions
1.3 Scope
1.3.1 Markets Covered
1.3.2 Years Considered
1.4 Currency
1.5 Limitations
1.6 Market Stakeholders
2 Research Methodology (Page No. – 24)
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 Secondary Sources
2.1.2 Primary Data
2.1.2.1 Breakdown of Primary Interviews
2.1.2.2 Key Data From Primary Sources
2.1.2.3 Key Industry Insights
2.2 Market Size Estimation
2.2.1 Bottom-Up Approach
2.2.1.1 Approach for Capturing Market Size By Bottom-Up Analysis (Demand Side)
2.2.2 Top-Down Approach
2.2.2.1 Approach for Capturing Market Size By Top-Down Analysis (Supply Side)
2.3 Market Breakdown and Data Triangulation
2.4 Research Assumptions
3 Executive Summary (Page No. – 37)
4 Premium Insights (Page No. – 42)
4.1 Attractive Growth Opportunities in Semiconductor Manufacturing Equipment Market
4.2 Market, By Country
4.3 Market, By Product Type
4.4 Front-End Market, By Equipment Type and Region
5 Market Overview (Page No. – 44)
5.1 Introduction
5.2 Market Dynamics
5.2.1 Drivers
5.2.1.1 Increasing Investments in R&D Facilities
5.2.1.2 Increasing Demand for Electric and Hybrid Vehicles
5.2.1.3 Growing Consumer Electronics Market and Increasing Number of Foundries
5.2.1.4 Trend of Miniaturization and Technology Migration
5.2.1.5 High Demand for Chips to Provide Computation Power and Connectivity for AI Applications
5.2.2 Restraints
5.2.2.1 High Purchase and Maintenance Costs
5.2.2.2 Complexity of Patterns and Functional Defects in Manufacturing Process
5.2.3 Opportunities
5.2.3.1 Rising Demand for Silicon-Based Sensors for IoT Devices
5.2.3.2 Expanding Chip Industry in China
5.2.3.3 Growing Number of Data Centers and Servers
5.2.3.4 Developing Market for Advanced Packaging Products
5.2.4 Challenges
5.2.4.1 Technical Problems Faced During Fabrication Process
5.2.4.2 Increased Complexities Related to Miniaturized Structures of Circuits
5.3 Value Chain Analysis
6 Semiconductor Manufacturing Equipment Market, By Front-End Equipment (Page No. – 61)
6.1 Introduction
6.2 Lithography
6.2.1 DUV Lithography
6.2.1.1 I-Line, KRF, ARF Dry, and ARFI are Some of the Key Sources Used in DUV Lithography
6.2.2 Euv Lithography
6.2.2.1 EUVL Designs Triple Or Even Quadruple Patterning at 10 Nm and
7 Nm Nodes and is Expected to Achieve 5 Nm Nodes (Page No. – 67)
6.3 Wafer Surface Conditioning
6.3.1 Etching
6.3.1.1 Piranha Etch, Potassium Hydroxide (Koh)Etch, and Silicon Nitride Etch are Some of the Key Wet Etching Techniques
6.3.2 Chemical Mechanical Planarization
6.3.2.1 CMP Plays A Crucial Role in Removing Unwanted Conductive Or Dielectric Materials on Silicon Wafers
6.4 Wafer Cleaning
6.4.1 Single-Wafer Spray System
6.4.1.1 Single-Wafer Spray System is an Effective Cleaning Technique With Minimal Damage
6.4.2 Single-Wafer Cryogenic System
6.4.2.1 Single-Wafer Cryogenic System is an Effective Technique in Post–Chemical Mechanical Polishing (CMP) Cleaning Processes
6.4.3 Batch Immersion Cleaning System
6.4.3.1 Batch Immersion Cleaning System is the Most Cost-Effective and Time-Saving Systems
6.4.4 Batch Spray Cleaning System
6.4.4.1 Batch Spray Cleaning System Can Process Large Batches With High Throughput Or Small Batches With Short Cycle Times
6.4.5 Scrubber
6.4.5.1 Scrubbers are One of the Most Commonly Used Tools for Mechanical Cleaning of Wafers
6.5 Deposition
6.5.1 Pvd
6.5.1.1 Pvd is A Commonly Used Deposition Technique for Low Accuracy Films
6.5.2 Cvd
6.5.2.1 Cvd is the Key Technique Used for Production of Thin Films and Complex Layered Micro- and Nano-Structures
6.6 Other Front-End Equipment
7 Semiconductor Manufacturing Equipment Market, By Back-End Equipment (Page No. – 83)
7.1 Introduction
7.2 Assembly and Packaging
7.2.1 Osat Companies are Contributing Significantly to the Growth of Assembly and Packaging Equipment Segment
7.3 Dicing
7.3.1 Plasma Dicing is Better Than Conventional Blade and Laser Dicing
7.4 Metrology
7.4.1 Growth in Automation has Led to Increased Penetration of Metrology Equipment to Reduce Defects
7.5 Bonding
7.5.1 3D Semiconductor Assembly and Packaging are Key Growth Factors for Bonding Equipment Segment
7.6 Wafer Testing
7.6.1 Rising Demand for High-Quality Electronic Products has Raised the Need for Testing Equipment During Fabrication and Assembly
8 Semiconductor Manufacturing Equipment Market, By Fab Facility (Page No. – 101)
8.1 Introduction
8.2 Automation
8.2.1 Automation Equipment Help in Resolving Complexities in Processes, Minimizing Waste, Reducing Costs, and Planning and Utilizing Resources Optimally
8.3 Chemical Control
8.3.1 Chemical Control Equipment Provide Controlled, Repeated, and Reliable Delivery of Chemicals in Semiconductor Manufacturing Process
8.4 Gas Control
8.4.1 Gas Control Equipment Play A Key Role in Providing Precisely Controlled Mix of Gases in Wafer Manufacturing Process
8.5 Others
8.5.1 Probing Machines are Majorly Used to Perform Electric Tests of Chips
9 Semiconductor Manufacturing Equipment Market, By Product Type (Page No. – 107)
9.1 Introduction
9.2 Memory
9.2.1 Shift in Memory Market Leads to Demand for Advanced Semiconductor Manufacturing Equipment
9.3 Foundry
9.3.1 Pure-Play Foundries Expected to Witness Strong Growth Due to Contracts From Fabless Players
9.4 Logic
9.4.1 Logic Devices are Critical Components in Electronic Circuits That Operate as Per Defined Programs
9.5 MPU
9.5.1 Extensive Use of MPUs in Many Consumer Electronics Expected to Boost Their Demand During Forecast Period
9.6 Discrete
9.6.1 Demand for Discrete Components is Driven By Their Role of Being A Base of Any Electronic Circuit
9.7 Analog, Mems, and Other
9.7.1 Growth of Mems is Attributed to Demand From Consumer Electronics
10 Semiconductor Manufacturing Equipment Market, By Dimension (Page No. – 119)
10.1 Introduction
10.2 2D
10.2.1 2D IC Technology is Used in Several Conventional High-End Applications Such as Smartphones and Tablets
10.3 2.5D
10.3.1 Use of Silicon Interposers on 2.5D ICs is an Incremental Step to Increase Capacity and Performance of Semiconductor Devices
10.4 3D
10.4.1 Need for Improved Electrical Performance Expected to Increase Demand for 3D ICs
11 Semiconductor Manufacturing Equipment Market, By Supply Chain Participant (Page No. – 125)
11.1 Introduction
11.2 IDM Firms
11.2.1 IDM Firms Rapidly Adopt Innovative Technologies and are Expected to Lead Market During Forecast Period
11.3 Osat Companies
11.3.1 Osat Companies to Play Significant Role Owing to Challenges Faced By Foundries Related to Assembly and Packaging
11.4 Foundries
11.4.1 Foundries have Dominance in APAC Region Owing to Presence of Major Players
12 Semiconductor Manufacturing Equipment Market, By Region (Page No. – 130)
12.1 Introduction
12.2 Americas
12.2.1 US
12.2.1.1 US Expected to Lead Market in Americas
12.2.2 Canada
12.2.2.1 Government Initiatives in the Country are Expected to Drive Market
12.2.3 Rest of Americas
12.2.3.1 Increasing Demand for IoT and 5G Surges the Need for Semiconductor Manufacturing Equipment in Rest of Americas
12.3 EMEA
12.3.1 Germany
12.3.1.1 Growth in Smart Homes and Connected Cars to Boost Demand for Semiconductor Manufacturing Equipment in Germany
12.3.2 UK
12.3.2.1 Growth in Communication Network and Increasing Collaboration to Spur Market in UK
12.3.3 Ireland
12.3.3.1 Presence of Intel Fab is the Key Reason for Market Growth in Ireland
12.3.4 France
12.3.4.1 Developed Communication Network has Prompted Market Growth in France
12.3.5 Italy
12.3.5.1 Enhancements in Technologies By Players Such as Stmicroelectronics Surge the Growth of Market in Italy
12.3.6 Rest of EMEA
12.3.6.1 Rest of EMEA is Home to Giant Players for Advanced Lithography and Next-Generation Packaging Equipment
12.4 APAC
12.4.1 South Korea
12.4.1.1 High Manufacturing Capability to Drive South Korean Market
12.4.2 China
12.4.2.1 Market in China to Grow at Highest Rate in APAC
12.4.3 Taiwan
12.4.3.1 Presence of Many Key Osat Companies Drives Market Growth in Taiwan
12.4.4 Japan
12.4.4.1 Increasing Demand for Vehicles and Consumer Electronics and Expanding Presence of Market Players in Country Fuel Market Growth in Japan
12.4.5 Rest of APAC
12.4.5.1 Presence of Fabrication Plants and Rising Consumer Electronics Demand to Drive Market in Rest of APAC
13 Competitive Landscape (Page No. – 151)
13.1 Overview
13.2 Key Players in Semiconductor Manufacturing Equipment Market
13.3 Competitive Leadership Mapping
13.3.1 Visionary Leaders
13.3.2 Innovators
13.3.3 Dynamic Differentiators
13.3.4 Emerging Companies
13.4 Strength of Product Portfolio (For 25 Companies)
13.5 Business Strategy Excellence (For 25 Companies)
13.6 Competitive Scenario
13.6.1 Product Launches & Developments
13.6.2 Partnerships, Collaborations, and Agreements
13.6.3 Mergers & Acquisitions and Expansions
14 Company Profiles (Page No. – 163)
(Business Overview, Products, Solutions, Services, & Technologies Offered, Recent Developments, SWOT Analysis, and MnM View)*
14.1 Introduction
14.2 Key Players
14.2.1 Tokyo Electron (TEL)
14.2.2 LAM Research
14.2.3 ASML
14.2.4 Applied Materials
14.2.5 Kla-Tencor
14.2.6 Screen Holdings
14.2.7 Teradyne
14.2.8 Advantest
14.2.9 Hitachi High-Technologies Corporation
14.2.10 Plasma-Therm
14.3 Right-To-Win (Key Market Players)
14.4 Other Companies
14.4.1 Rudolph Technologies
14.4.2 Veeco Instruments
14.4.3 EV Group
14.4.4 Nanometrics
14.4.5 Nordson
14.4.6 Advanced Dicing Technologies
14.4.7 Quik-Pak
14.4.8 Evatec
14.4.9 Noivion
14.4.10 Semiconductor Equipment Corporation
*Details on Business Overview, Products, Solutions, Services, & Technologies Offered, Recent Developments, SWOT Analysis, and MnM View Might Not Be Captured in Case of Unlisted Companies.
15 Appendix (Page No. – 206)
15.1 Discussion Guide
15.2 Knowledge Store: Marketsandmarkets’ Subscription Portal
15.3 Available Customizations
15.4 Related Reports
15.5 Author Details


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