<産業資料/調査レポートの題名> 2022年7月19日

特殊用途ロジックICの世界市場2018-2022


◆英文タイトル:Global Special Purpose Logic IC Market 2018-2022

PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
PART 03: RESEARCH METHODOLOGY
PART 04: MARKET LANDSCAPE
• Market ecosystem
• Market characteristics
• Market segmentation analysis
PART 05: MARKET SIZING
• Market definition
• Market sizing 2017
• Market size and forecast 2017-2022
PART 06: FIVE FORCES ANALYSIS
• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition
PART 07: MARKET SEGMENTATION BY APPLICATION
• Segmentation by application
• Comparison by application
• Communications– Market size and forecast 2017-2022
• Computing – Market size and forecast 2017-2022
• Consumer electronics– Market size and forecast 2017-2022
• Others – Market size and forecast 2017-2022
• Market opportunity by application
PART 08: CUSTOMER LANDSCAPE
PART 09: REGIONAL LANDSCAPE
• Geographical segmentation
• Regional comparison
• APAC – Market size and forecast 2017-2022
• Americas – Market size and forecast 2017-2022
• EMEA– Market size and forecast 2017-2022
• Key leading countries
• Market opportunity
PART 10: DECISION FRAMEWORK
PART 11: DRIVERS AND CHALLENGES
• Market drivers
• Market challenges
PART 12: MARKET TRENDS
• Change in wafer size
• Increased proliferation of IoT
• Increased M&A in the semiconductor market
PART 13: VENDOR LANDSCAPE
• Overview
• Landscape disruption
PART 14: VENDOR ANALYSIS
• Vendors covered
• Vendor classification
• Market positioning of vendors
• Broadcom
• Intel
• QUALCOMM
• STMicroelectronics
• Texas Instruments
PART 15: APPENDIX
• List of abbreviations

Exhibit 01: Parent market
Exhibit 02: Global semiconductor market
Exhibit 03: Market characteristics
Exhibit 04: Market segments
Exhibit 05: Market definition – Inclusions and exclusions checklist
Exhibit 06: Market size 2017
Exhibit 07: Validation techniques employed for market sizing 2017
Exhibit 08: Global – Market size and forecast 2017-2022 ($ bn)
Exhibit 09: Global – Year-over-year growth 2018-2022 (%)
Exhibit 10: Five forces analysis 2017
Exhibit 11: Five forces analysis 2022
Exhibit 12: Bargaining power of buyers
Exhibit 13: Bargaining power of suppliers
Exhibit 14: The threat of new entrants
Exhibit 15: Threat of substitutes
Exhibit 16: Threat of rivalry
Exhibit 17: Market condition – Five forces 2017
Exhibit 18: Application – Market share 2017-2022 (%)
Exhibit 19: Comparison by end-user
Exhibit 20: Communications – Market size and forecast 2017-2022 ($ bn)
Exhibit 21: Communications – Year-over-year growth 2018-2022 (%)
Exhibit 22: Computing – Market size and forecast 2017-2022 ($ bn)
Exhibit 23: Computing – Year-over-year growth 2018-2022 (%)
Exhibit 24: Consumer electronics – Market size and forecast 2017-2022 ($ bn)
Exhibit 25: Consumer electronics – Year-over-year growth 2018-2022 (%)
Exhibit 26: Others – Market size and forecast 2017-2022 ($ bn)
Exhibit 27: Others – Year-over-year growth 2018-2022 (%)
Exhibit 28: Market opportunity by application
Exhibit 29: Customer landscape
Exhibit 30: Global – Market share by geography 2017-2022 (%)
Exhibit 31: Regional comparison
Exhibit 32: APAC – Market size and forecast 2017-2022 ($ bn)
Exhibit 33: APAC – Year-over-year growth 2018-2022 (%)
Exhibit 34: Americas – Market size and forecast 2017-2022 ($ bn)
Exhibit 35: Americas – Year-over-year growth 2018-2022 (%)
Exhibit 36: EMEA – Market size and forecast 2017-2022 ($ bn)
Exhibit 37: EMEA – Year-over-year growth 2018-2022 (%)
Exhibit 38: Key leading countries
Exhibit 39: Market opportunity
Exhibit 40: Global smartphone shipment 2017-2022 (billions of units)
Exhibit 41: Global tablet shipments 2017-2022 (millions of units)
Exhibit 42: CAGR of 3D NAND and DRAM over the forecast period
Exhibit 43: Timeline for semiconductor wafer size advancements
Exhibit 44: Vendor landscape
Exhibit 45: Landscape disruption
Exhibit 46: Vendors covered
Exhibit 47: Vendor classification
Exhibit 48: Market positioning of vendors
Exhibit 49: Broadcom – Overview
Exhibit 50: Broadcom – Business segments
Exhibit 51: Broadcom – Organizational developments
Exhibit 52: Broadcom – Geographic focus
Exhibit 53: Broadcom – Segment focus
Exhibit 54: Broadcom – Key offerings
Exhibit 55: Intel – Overview
Exhibit 56: Intel – Business segments
Exhibit 57: Intel – Organizational developments
Exhibit 58: Intel – Geographic focus
Exhibit 59: Intel – Segment focus
Exhibit 60: Intel – Key offerings
Exhibit 61: Vendor – Overview
Exhibit 62: QUALCOMM – Business segments
Exhibit 63: QUALCOMM– Organizational developments
Exhibit 64: QUALCOMM – Geographic focus
Exhibit 65: QUALCOMM – Segment focus
Exhibit 66: QUALCOMM – Key offerings
Exhibit 67: STMicroelectronics – Overview
Exhibit 68: STMicroelectronics – Business segments
Exhibit 69: STMicroelectronics – Organizational developments
Exhibit 70: STMicroelectronics – Geographic focus
Exhibit 71: STMicroelectronics – Segment focus
Exhibit 72: STMicroelectronics – Key offerings
Exhibit 73: Vendor – Overview
Exhibit 74: Texas Instruments – Business segments
Exhibit 75: Texas Instruments – Organizational developments
Exhibit 76: Texas Instruments – Geographic focus
Exhibit 77: Texas Instruments – Segment focus
Exhibit 78: Texas Instruments – Key offerings


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