<産業資料/調査レポートの題名> 2022年7月19日

半導体ウエハー検査装置の世界市場2019-2023


◆英文タイトル:Global Semiconductor Wafer Inspection Equipment Market 2019-2023

PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
PART 03: MARKET LANDSCAPE
• Market ecosystem
• Market segmentation analysis
• Market characteristics
PART 04: MARKET SIZING
• Market definition
• Market sizing 2018
• Market size and forecast 2018-2023
PART 05: FIVE FORCES ANALYSIS
• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition
PART 06: MARKET SEGMENTATION BY TECHNOLOGY
• Market segmentation by technology
• Comparison by technology
• Optical wafer inspection – Market size and forecast 2018-2023
• E-beam wafer inspection – Market size and forecast 2018-2023
• Market opportunity by technology
PART 07: CUSTOMER LANDSCAPE
PART 08: MARKET SEGMENTATION BY END-USER
• Market segmentation by end-user
• Comparison by end-user
• Foundries – Market size and forecast 2018-2023
• IDMs – Market size and forecast 2018-2023
• Market opportunity by end-user
PART 09: GEOGRAPHIC LANDSCAPE
• Geographic segmentation
• Geographic comparison
• APAC – Market size and forecast 2018-2023
• Americas – Market size and forecast 2018-2023
• EMEA – Market size and forecast 2018-2023
• Key leading countries
• Market opportunity
PART 10: DRIVERS AND CHALLENGES
• Market drivers
• Market challenges
• Increasing focus on large diameter wafer size
• Growing investments in lower technology node
• Growing investment in 3D NAND and FinFET technologies
PART 11: VENDOR LANDSCAPE
• Overview
• Landscape disruption
• Competitive scenario
PART 12: VENDOR ANALYSIS
• Vendors covered
• Vendor classification
• Market positioning of vendors
• Applied Materials
• ASML
• Hitachi High-Technologies
• KLA-Tencor
• Rudolph Technologies
PART 13: APPENDIX
• Research methodology
• List of abbreviations


Exhibit 01: Preface
Exhibit 02: Preface
Exhibit 03: Global semiconductor capital equipment market
Exhibit 04: Segments of global semiconductor capital equipment market
Exhibit 05: Market segments
Exhibit 06: Market characteristics
Exhibit 07: Market definition – Inclusions and exclusions checklist
Exhibit 08: Market size 2018
Exhibit 09: Global market: Size and forecast 2018-2023 ($ millions)
Exhibit 10: Global market: Year-over-year growth 2019-2023 (%)
Exhibit 11: Five forces analysis 2018
Exhibit 12: Five forces analysis 2023
Exhibit 13: Bargaining power of buyers
Exhibit 14: Bargaining power of suppliers
Exhibit 15: Threat of new entrants
Exhibit 16: Threat of substitutes
Exhibit 17: Threat of rivalry
Exhibit 18: Market condition – Five forces 2018
Exhibit 19: Technology – Market share 2018-2023 (%)
Exhibit 20: Comparison by technology
Exhibit 21: Optical wafer inspection – Market size and forecast 2018-2023 ($ millions)
Exhibit 22: Optical wafer inspection – Year-over-year growth 2019-2023 (%)
Exhibit 23: E-beam wafer inspection – Market size and forecast 2018-2023 ($ millions)
Exhibit 24: E-beam wafer inspection – Year-over-year growth 2019-2023 (%)
Exhibit 25: Market opportunity by technology
Exhibit 26: Customer landscape
Exhibit 27: End-user – Market share 2018-2023 (%)
Exhibit 28: Comparison by end-user
Exhibit 29: Foundries – Market size and forecast 2018-2023 ($ millions)
Exhibit 30: Foundries – Year-over-year growth 2019-2023 (%)
Exhibit 31: IDMs – Market size and forecast 2018-2023 ($ millions)
Exhibit 32: IDMs – Year-over-year growth 2019-2023 (%)
Exhibit 33: Market opportunity by end-user
Exhibit 34: Market share by geography 2018-2023 (%)
Exhibit 35: Geographic comparison
Exhibit 36: Major semiconductor foundries in APAC
Exhibit 37: APAC – Market size and forecast 2018-2023 ($ millions)
Exhibit 38: APAC – Year-over-year growth 2019-2023 (%)
Exhibit 39: Americas – Market size and forecast 2018-2023 ($ millions)
Exhibit 40: Americas – Year-over-year growth 2019-2023 (%)
Exhibit 41: Major foundries in EMEA
Exhibit 42: EMEA – Market size and forecast 2018-2023 ($ millions)
Exhibit 43: EMEA – Year-over-year growth 2019-2023 (%)
Exhibit 44: Key leading countries
Exhibit 45: Market opportunity
Exhibit 46: Decision framework
Exhibit 47: Impact of drivers and challenges
Exhibit 48: Vendor landscape
Exhibit 49: Landscape disruption
Exhibit 50: Vendors covered
Exhibit 51: Vendor classification
Exhibit 52: Market positioning of vendors
Exhibit 53: Applied Materials – Vendor overview
Exhibit 54: Applied Materials – Business segments
Exhibit 55: Applied Materials – Organizational developments
Exhibit 56: Applied Materials – Geographic focus
Exhibit 57: Applied Materials – Segment focus
Exhibit 58: Applied Materials – Key offerings
Exhibit 59: ASML – Vendor overview
Exhibit 60: ASML – Organizational developments
Exhibit 61: ASML – Geographic focus
Exhibit 62: ASML – Key offerings
Exhibit 63: Hitachi High-Technologies – Vendor overview
Exhibit 64: Hitachi High-Technologies – Business segments
Exhibit 65: Hitachi High-Technologies – Organizational developments
Exhibit 66: Hitachi High-Technologies – Segment focus
Exhibit 67: Hitachi High-Technologies – Key offerings
Exhibit 68: KLA-Tencor – Vendor overview
Exhibit 69: KLA-Tencor – Organizational developments
Exhibit 70: KLA-Tencor – Geographic focus
Exhibit 71: KLA-Tencor – Key offerings
Exhibit 72: Rudolph Technologies – Vendor overview
Exhibit 73: Rudolph Technologies – Organizational developments
Exhibit 74: Rudolph Technologies – Geographic focus
Exhibit 75: Rudolph Technologies – Key offerings
Exhibit 76: Validation techniques employed for market sizing
Exhibit 77: List of abbreviations


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